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| A Primedia Property | |
| August 28, 2003 | |
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Table of Contents NTT DoCoMo to establish 4G communications research center in Beijing Elpida Memory establishes semiconductor company Survey shows fabless revenue up over 20 percent from 2Q 2003 Temex introduces microwave ceramics for space applications TriQuint announces Amkor collaboration on CuFLIP processes for mobile phone modules Verisity offers free verification seminars ADVERTISEMENT 
Mini-Circuits(R) ... A Commitment of Total Support to Our Customers As a global leader in the design, manufacturing, and distribution of RF, IF, and microwave components, Mini-Circuits(R) provides signal processing solutions and the matchless expertise you need to fuel your project's success. Rapid response, innovative design, demanding quality standards, fast turnaround, value pricing, on-time delivery, and top notch customer service have helped make Mini-Circuits(R) the industries powerhouse for support, providing to you that extra edge in today's competitive wireless and digital communication markets. Please visit us at: http://www.minicircuits.com/products.htm. News NTT DoCoMo to establish 4G communications research center in Beijing RF Design Staff Tokyo, Japan -- NTT DoCoMo Inc. announced that it will establish DoCoMo Communications Laboratories Beijing Co. Ltd. to research and promote the advancement of mobile communication technologies for fourth-generation (4G) and beyond. The new wholly owned subsidiary of NTT DoCoMo is capitalized at $5.3 million, and will be operational this year. In a statement announcing the establishment of its 4G lab, NTT DoCoMo says China has aggressively committed to 4G research and development, and is expected to evolve the requisite new standards. DoCoMo says it expects the envisioned laboratory to promote advanced mobile communications technology in both countries in line with the joint statement issued at the People's Republic of China-Japan-Republic of Korea Information and Telecommunication Ministerial Meeting held last September in Marrakech. Elpida Memory establishes semiconductor company RF Design Staff Hiroshima, Japan -- Elpida Memory Inc. announced the establishment of a new semiconductor manufacturing company -- Hiroshima Elpida Memory Inc. In the same statement, Elpida also announced that NEC Corp. and NEC Hiroshima have agreed to integrate the manufacturing operations of NEC Hiroshima Ltd., a wholly owned subsidiary of NEC Corp., into the new company. Hiroshima Elpida will be established on September 1, 2003, as a wholly owned subsidiary of Elpida. The company says the move is being made to enable Elpida to establish a framework for its entire DRAM business, including device development and marketing functions, as well as processing and production capabilities. As part of the agreement, employees from NEC Hiroshima will be re-assigned to Hiroshima Elpida. Hiroshima Elpida will lease the property and the 200 mm manufacturing facility from NEC Hiroshima. To date, Elpida had outsourced its state-of-the-art 300 mm wafer manufacturing to NEC Hiroshima. This agreement enables Hiroshima Elpida to operate 200 mm and 300 mm manufacturing simultaneously, the company says. Survey shows fabless revenue up over 20 percent from 2Q 2003 RF Design Staff SAN JOSE, Calif. -- Revenue from fabless operations rose more that 19 percent in the second quarter of 2003, compared to the same quarter in 2002, and reached $4.2 billion, says a report from the Fabless Semiconductor Association (FSA). The report, published the organization's quarterly journal, On the Fabless Front,, is an annual survey of management information systems (MIS). Fabless revenue also rose 5.3 percent sequentially from $3.9 billion in Q1 2003 According to the report, the top three fabless companies -- using Q2 2003 data -- remained the same as in Q1: Qualcomm Inc.'s CDMA division with $557.2 million in revenue; NVidia Corp. with $459.8 million; and Broadcom Corp. with $377.9 million. The remainder of the top 10 included ATI Technologies Inc., Xilinx Inc., SanDisk Corp., MediaTek Inc., Altera Corp., Marvell Technology Group Ltd., and Conexant Systems Inc., respectively. The FSA also found that there were 32 fabless mergers and acquisitions, totaling more than $966 million, in the first eight months of 2003. Six of these acquisitions involved fabless companies acquiring other fabless companies, while the other 26 acquisitions involved fabless companies acquiring other technology companies. ADVERTISEMENT 
Check out RF Design's new look, unveiling in September! For 25 years, you have relied on RF Design for the technical, tutorial-style information that is essential to better, stronger, faster next-generation communication components. And nothing's changed. Except our look. Check out the September issue, when we will deliver the RF and microwave technology for today's design engineers in a easier-to-find-what-you're-looking-for package. Products Temex introduces microwave ceramics for space applications RF Design Staff Paris, France -- Temex, a subsidiary of the Tekelec Group, introduced a new range of microwave ceramics dedicated to space applications -- the E3000 range. The E3000 family is targeted specifically at space and military applications requiring temperatures ranging from -55° C to +125° C. The new ceramic material gives a high dielectric constant to around 35, aiding size reduction while maintaining a high Q factor for stable DRO designs. The E3000 range is manufactured to provide a wide selection of temperature coefficients, all with tight frequency tolerances, the company says. There are currently six options available with temperature coefficients ranging from 0 ppm/degrees C to 10 ppm/degrees C, all offering a Q factor of 4,000 at 10 GHz. TriQuint announces Amkor collaboration on CuFLIP processes for mobile phone modules RF Design Staff Hillsboro, Ore. -- TriQuint Semiconductor Inc. announced its collaboration with Amkor Technology Inc. to commercialize a low-cost flip-chip assembly process for GaAs semiconductors based on TriQuint's CuFlip bumping technology. Amkor will provide TriQuint with high-volume production capacity to quickly ramp-up CuFlip based products, the company says. Using CuFlip copper bumps, electrical connections once made by wire bonds are now possible by directly linking contact points on a semiconductor die to the module ceramic or laminate substrate, the company says. The CuFlip process is compatible with standard laminate substrate materials. TriQuint has already introduced the CuFlip process in the 6 mm x 6 mm TQM 7M4009 GSM power amplifier module (PAM). The company says CuFlip-based assembly is an important milestone in TriQuint's long-term strategy of integrating the RF front-end for mobile phones utilizing the company's technology portfolio of power amplifiers, pHEMT switches, integrated passives and SAW filter components. Calendar Verisity offers free verification seminars Mountain View, Calif. -- Verisity Ltd. announced it is offering free "Next-Generation Verification Seminars" in the Fall of 2003 in North America, Europe and Asia. Verisity's verification methodology seminars will introduce verification process automation (VPA) and offer step-by-step guidelines for achieving first-pass silicon success with today's extremely complex chips, systems, hardware and software systems and SoCs. Attendees will also hear from partners who've used these automation methodologies on real-world designs. The seminars will be highly technical, and focus on verification process automation methodology and techniques. Seminar Schedule and Registration To register and obtain more details on the agenda, go to the seminar registration page. You can also register by sending an email to seminars@verisity.com. The next-generation verification seminars will be held in North America in September and October, Europe in October, and Asia in November. North America
September 15.......Los Angeles, Calif. Europe
October 15...........Munich, Germany Asia
October 31..........Kyoto, Japan |
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