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| A Primedia Property | |
| August 14, 2003 | |
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| Table of Contents Handset market increased 2 percent in second quarter says market research M/A-COM agrees to supply GPS antennas to Ford Maxim introduces single-chip 802.11b transceiver with integrated PA and switch Cypress Semiconductor samples 2.4 GHz radio system-on-a-chip priced under $2 Centurion unveils tri-band micro antenna Ceramic Interconnect Technology -- The Next Generation II ADVERTISEMENT 
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News Handset market increased 2 percent in second quarter says market research RF Design Staff Oyster Bay, N.Y. - The total handset market increased to 107 million units in the second quarter of 2003, demonstrating a marginal increase of 2 percent sequentially and 12 percent growth year-on-year, says a market research report from Allied Business Intelligence (ABI). The ABI report, from the company's wireless handset subscription service, says that the surge in handset shipments is fueled by new features, such as color screens and camera phones, and that replacement shipments now account for nearly two-thirds of all handsets shipped. The report also claims that nearly 3.6 million units of smartphones and smartphone-PDAs were sold in the second quarter of 2003, representing approximately 3.3 percent of the overall handset market. ABI believes the trend will continue, and color screens will account for about 97 percent of all shipments by 2008. Nokia Corp. continued to lead the market with a 38 percent market share, shipping over a third of its units with color screens. Sony Ericsson staged a dramatic comeback with 6.7 million handset shipments, grabbing the fifth position from LG Electronics. M/A-COM agrees to supply GPS antennas to Ford RF Design Staff Lowell, Mass. -- M/A-Com, a business unit of Tyco Electronics Corp., announced an agreement with Ford Motor Co. to provide GPS navigation system antennas for several of its vehicle lines. Under the terms of the agreement, M/A-COM's GPS antennas will be installed across several Ford, Lincoln, and Mercury vehicle platforms. The internally mounted antennas provide GPS reception for customer convenience services such as onboard mapping and destination routing. ADVERTISEMENT  Check out RF Design's new look, unveiling in September! For 25 years, you have relied on RF Design for the technical, tutorial-style information that is essential to better, stronger, faster next-generation communication components. And nothing's changed. Except our look. Check out the September issue, when we will deliver the RF and microwave technology for today's design engineers in a easier-to-find-what-you're-looking-for package. Products Maxim introduces single-chip 802.11b transceiver with integrated PA and switch RF Design Staff Sunnyvale, Calif. -- Maxim Integrated Products Inc. announced the expansion of its WLAN RFIC product line with the MAX2822. According to the company, it is the industry's first 802.11b, single-chip transceiver with an integrated power amplifier and transmit/receive switch. The MAX2822 includes all the circuitry required to implement an RF-to-baseband transceiver solution -- only a 2.4 GHz ISM bandpass filter-balun chip is needed to complete the entire RF front end. The 50 Ohms match to the low-noise amplifier (LNA) and PA are also integrated. The MAX2822-based RF PCB area measures 200 mm2, making it ideal for PDA, cellular smartphone, compact flash, secure digital, and other embedded module applications, the company says. It delivers +17 dBm linear power at the PA output, with a total power control range of 20 dB, while meeting 802.11b adjacent and alternate channel requirements. The MAX2822 is controlled by the baseband/MAC chip through a 3-wire interface that is pin-for-pin compatible with the current MAX2820 ZIF transceiver chip. It operates over a 2.7 V to 3.0 V supply range and is available in a 48-pin QFN, 7 mm x 7 mm leadless package. Prices start at $5.91 for quantities starting at 10,000. Cypress Semiconductor samples 2.4 GHz radio system-on-a-chip priced under $2 RF Design Staff San Jose, Calif. -- Cypress Semiconductor Corp. announced that it has begun sampling its WirelessUSB LS. The company claims it is the industry's lowest-cost 2.4 GHz radio system-on-a-chip -- currently priced under $2 and moving below $1 over the next two year. The company also says the device offers manufacturers and end-users of wireless PC and video game console peripherals a combination of high performance and low cost. WirelessUSB LS devices communicate at distances of up to 10 meters. The technology features a highly integrated radio transceiver and digital baseband. It operates in the 2.4 GHz global ISM band. Cypress uses a direct sequence spread spectrum coding scheme to ensure operation in the presence of 802.11 and Bluetooth networks. WirelessUSB LS is available as a transceiver or a transmit-only device, providing bi-directional or unidirectional RF transmission at 62.5 kbps. The WirelessUSB LS transmit-only device (CYWUSB6932) is priced starting at $1.95 in 100,000-unit quantities; the transceiver device (CYWUSB6934) begins at $2.20. The CY3632 WirelessUSB LS development kit is $495. Centurion unveils tri-band micro antenna RF Design Staff Lincoln, Neb. -- Centurion Wireless Technologies Inc. announced the tri-band D-Puck internal antenna for 802.11a, 802.11b and 802.11g applications. The D-Puck is a tri-band micro antenna for portable devices, such as laptops and PDAs, as well as fixed devices such as WLAN access points and cable modem gateways. The D-Puck supports the 802.11 a, 802.11b and 802.11g frequency bands at 2.4 GHz to 2.5 GHz, and 5.15 GHz to 5.875 GHz. The D-Puck can be integrated into laptops and handheld devices to access networks that use different frequencies within the 2 GHz and 5 GHz bands. It can also be used as the internal companion to an external antenna to enable antenna diversity. The D-Puck features mixed polarization, and is an internal planar inverted F antenna that requires a small ground plane to radiate efficiently at a gain of +3 dBi in all operation bands. The antenna weighs 2 grams and has dimensions of 16 mm x 16 mm x 6 mm. It comes in tape and reel packaging for high volume manufacturing. Calendar Ceramic Interconnect Technology -- The Next Generation II Hyatt Regency Hotel Denver Denver, Colo. April 27-28, 2004 Sponsored by the International Microelectronics And Packaging Society (IMAPS). Endorsed by The American Ceramic Society The growth of wireless communications in both developed and developing nations continues to create a host of opportunities for which ceramic technology is enabling. Automotive applications, and MEMS sensor and energy areas are moving from the laboratory to commercial status. The conference will have speakers representing global industrial, academic and government laboratories presenting developments across the spectrum of ceramics applications. Abstract Cut-off: December 5, 2003 |
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